PCBA Process Capability

Item

Volume

Prototype/Small Volume

PCB Specification of SMT Operation

Length x Width

Minimum

50x30

L<50 or W<30

Maximum

450x350

800≥l>450 or 400≥W>350

Thickness

Thinnest

0.8

T<0.8

Thickest

5

T>5

PCB Specification of DIP Operation

Length x Width

Minimum

50x30

L<50

Maximum

500x300

1000≥l>500 or 450≥W>300

Thickness

Thinnest

0.8

T<0.8

Thickest

5

T>5

Specification of SMT Component

Outline Size

Minimum Specifications

0603 (0201)

0602 (01005)

Maximum Size

45x45

45x45<Size≤68x68 (45x150)

Thickness of Component

25.4

T>25.4

QFP/SOP/SOJ/IC Socket etc.

Minimum Distance of PIN

Pitch=0.4

Pitch=0.3

CSP, BGA

Minimum Distance of BGA Ball

Pitch=0.5

0.3≤Pitch<0.5