Item |
Volume |
Prototype/Small Volume |
||
PCB Specification of SMT Operation |
Length x Width |
Minimum |
50x30 |
L<50 or W<30 |
Maximum |
450x350 |
800≥l>450 or 400≥W>350 |
||
Thickness |
Thinnest |
0.8 |
T<0.8 |
|
Thickest |
5 |
T>5 |
||
PCB Specification of DIP Operation |
Length x Width |
Minimum |
50x30 |
L<50 |
Maximum |
500x300 |
1000≥l>500 or 450≥W>300 |
||
Thickness |
Thinnest |
0.8 |
T<0.8 |
|
Thickest |
5 |
T>5 |
||
Specification of SMT Component |
Outline Size |
Minimum Specifications |
0603 (0201) |
0602 (01005) |
Maximum Size |
45x45 |
45x45<Size≤68x68 (45x150) |
||
Thickness of Component |
25.4 |
T>25.4 |
||
QFP/SOP/SOJ/IC Socket etc. |
Minimum Distance of PIN |
Pitch=0.4 |
Pitch=0.3 |
|
CSP, BGA |
Minimum Distance of BGA Ball |
Pitch=0.5 |
0.3≤Pitch<0.5 |
Shenzhen YQ Electronic Technology Co., Ltd
Tel: 0086-199 2492 3689
Email: info@yq-pcb.com
Add: SMT Factory: Floor 6, Lingbei 4th Road, Phoenix Community, Fuyong Street, Baoan District, Shenzhen City.
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