PCB Technical Capability

PCB Technical Capability

 

Description Parameters Remarks
Max layers number 28L  
Min  LW 3mil Copper Thickness 0.5 OZ
Min  LS 3mil Copper Thickness 0.5 OZ
Min welding ring Vias: 4mil Ring is welded to the hold edge distance of the outermost ring
Hole devices:5mil
Min hole diameter Through hole 0.15mm  
laser via hole 0.1mm  
Max thickness Single and  Double 0.2-6.0mm  
MLB 0.4-8.0mm  
Max Aspect Ratio finished 13:1  
Max Size Single and Double 600 x 1200mm  
MLB 500 x 1200mm  
Impedance Control Tolerance 土10%  
Solder Mask coloer Green, Blue, White, Black, Yellow, Red, Purple
Character White、Yellow、Black
Surface coating HASL、Electroless nickel/gold , Immersion Tin, Immersion Silver , OSP
Finished copper thickness outer layer 6 oz  
inner layer 6 oz  
Material FR4, ROGERS, ARLON, TACONIC, NELCO, ISOLA,  Al-base

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CONTACT US

Shenzhen YQ Electronic Technology Co., Ltd

Tel: 0086-199 2492 3689

Email: info@yq-pcb.com

Add: SMT Factory: Floor 6, Lingbei 4th Road, Phoenix Community, Fuyong Street, Baoan District, Shenzhen City.